NI Multisim 13.0 Enhances Analog, Digital and Power Circuit Simulation for Education, Research, and Professional Design

This intuitive schematic capture environment improves student comprehension and reduces prototype iterations and development costs for design and test engineers.

AUSTIN, Texas, Oct. 8, 2013 — (PRNewswire) — National Instruments (Nasdaq: NATI) introduces Multisim 13.0, a best-in-class SPICE simulation environment used by educators, students and engineers worldwide to explore, design and prototype circuits.

New Multisim 13.0 benefits include:

  • Circuit parameter and parameter sweep analysis
  • Digital circuits education with NI myRIO and Digilent FPGA targets
  • Power electronics analysis with IGBT and MOSFET thermal models
  • Device library of 26,000+ components
  • Design automation with the NI LabVIEW Multisim API Toolkit

Multisim 13.0 offers comprehensive circuit analysis tools for analog, digital and power electronics. The graphical, interactive environment helps educators to reinforce circuit theory and bridge the gap between the classroom and hands-on laboratory learning. The same advanced Multisim analysis capabilities are also used in various industries to explore design decisions and optimize circuit behavior with mixed-mode simulation.

To take students from basic electronics comprehension to complex final year design projects, Multisim includes courseware and laboratory hardware integration to NI myDAQ, NI ELVIS, NI myRIO and digital products from Digilent, for a complete solution to multiple courses. Multisim 13.0 also boasts ready-to-use daughterboard templates to speed design time for NI Single-Board RIO hardware and more.

"We chose Multisim for the breadth it provides us, allowing first year undergraduate students to understand fundamental analog and digital electronics, but also the depth so that final year masters students can use it in their projects," said Danielle George,  Faculty Member of Engineering and Physical Sciences at the University of Manchester.

Using the latest device simulation models from leading semiconductor manufacturers in an interactive analysis environment, aerospace, energy and life science applications are evaluated, optimized and designed to meet specifications on time.

Additionally, the Multisim API Toolkit for LabVIEW system design software defines countless applications to correlate measurements, sweep domain specific conditions and analyze performance with a flexibility unavailable to conventional simulation environments.

Additional Resources

LabVIEW, Multisim, National Instruments, NI, and ni.com are trademarks of National Instruments. Other product and company names listed are trademarks or trade names of their respective companies.

CONTACT: Beth Williams, Email Contact, (512) 683-6394

SOURCE National Instruments

Contact:
National Instruments
Web: http://www.ni.com




Review Article Be the first to review this article
Rand3D

Featured Video
Jobs
Mechanical Engineer I for Air Techniques, Inc at Melville, NY
Proposal Support Coordinator for Keystone Aerial Surveys at Philadelphia, PA
Upcoming Events
The Rise of Mechatronics at Dassault Systèmes San Diego 5005 Wateridge Vista Drive San Diego CA - Sep 12, 2017
The Rise of Mechatronics at Buca di Beppo - Pasadena 80 West Green Street Pasadena CA - Sep 13, 2017
The Rise of Mechatronics at Dassault Systèmes Santa Clara 3979 Freedom Circle, Ste 750 Santa Clara CA - Sep 14, 2017
The 30th Annual Integrated Process Excellence Symposium & Training at Wyndham Grand Bonnet Creek Resort Orlando FL - Sep 18 - 20, 2017
Kenesto: 30 day trial
SolidCAM: Cutting Webinar



Internet Business Systems © 2017 Internet Business Systems, Inc.
25 North 14th Steet, Suite 710, San Jose, CA 95112
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation GISCafe - Geographical Information Services TechJobsCafe - Technical Jobs and Resumes ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy Policy Advertise