TSMC and Cadence Deliver 3D-IC Reference Flow for True 3D Stacking

SAN JOSE, CA -- (Marketwired) -- Sep 19, 2013 -- Cadence Design Systems, Inc. (NASDAQ: CDNS)

Highlights:

  • New reference flow enhances CoWoS™ (chip-on-wafer-on-substrate) chip design
  • Flow certified using a memory-on-logic design with a 3D stack

Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced that TSMC has collaborated with Cadence to develop a 3D-IC reference flow which features innovative true 3D stacking. The flow, validated on a memory-on-logic design with a 3D stack based on a Wide I/O interface, enables multiple die integration. It incorporates TSMC 3D stacking technology and Cadence® solutions for 3D-IC, including integrated planning tools, a flexible implementation platform, and signoff and electrical/thermal analysis.

3D-IC technology enables companies to seek power/performance advances by opening up a new opportunity in addition to moving to advanced geometries. Offering several key benefits for engineers developing today's complex designs, 3D-ICs deliver higher performance, reduced power consumption, and smaller form factor. Today's announcement follows work the two 3D- IC leaders announced a year ago with the delivery of TSMC's CoWoS™ Reference Flow.

"We have worked closely with Cadence to enable true 3D chip development," said Suk Lee, TSMC senior director, Design Infrastructure Marketing Division. "With this new reference flow, our mutual customers can move forward confidently with 3D-IC development, knowing that their Cadence tool flow has been validated in silicon with 3D-IC test vehicles."

"3D-IC represents a dramatic new approach to product integration. It provides a new dimension to Moore's Law and requires a deep collaboration for a seamless enablement offering," said Dr. Chi-Ping Hsu, chief strategy officer and senior vice president of the digital and signoff group at Cadence. "This latest reference flow demonstrates real progress in our work with TSMC to make 3D chips not just viable, but an attractive option for addressing chip complexity."

Tools in the Cadence 3D-IC flow span digital, custom/analog and signoff technologies. They include Encounter® Digital Implementation System, Tempus™ Timing Signoff Solution, Virtuoso® Layout Editor, Physical Verification System, QRC Extraction, Encounter Power System, Encounter Test, Allegro® SiP, and Sigrity™ XcitePI/PowerDC.

About Cadence

Cadence enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software, hardware, IP, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available here.

© 2013 Cadence Design Systems, Inc. All rights reserved worldwide. Cadence, Allegro, Encounter, Sigrity, Tempus, Virtuoso and the Cadence logo are trademarks of Cadence Design Systems, Inc. in the United States and other countries. All other trademarks are the property of their respective owners.

Add to Digg Bookmark with del.icio.us Add to Newsvine

For more information, please contact:
Cadence Newsroom
408-944-7226

newsroom@cadence.com 





Review Article Be the first to review this article
Featured Video
Jobs
Mechanical Engineer for Allen & Shariff Corporation at Pittsburgh, Pennsylvania
Mid-Level Mechanical Engineer for Kiewit at lenexa, Kansas
Director of Process Engineering. for Tekni-Plex at Toledo, Ohio
System Designer/Engineer for Bluewater at Southfield, Michigan
Director, Business Development for Kongsberg Geospatial at Ottawa, Canada
Director, Business Development for Kongsberg Geospatial at remote from home, Any State in the USA
Upcoming Events
Montréal Manufacturing Technology Show (MMTS) 2018 at Place Bonaventure Montréal Canada - May 14 - 16, 2018
ESPRIT World 2018 at Indianapolis Marriott Downtown 350 West Maryland Street Indianapolis IN - Jun 11 - 15, 2018
HxGN LIVE 2018 at The Venetian Las Vegas NV - Jun 12 - 15, 2018
IMTS2018 International Manufacturing Tech Show at McCormick Place Chicago IL - Sep 10 - 15, 2018



Internet Business Systems © 2018 Internet Business Systems, Inc.
25 North 14th Steet, Suite 710, San Jose, CA 95112
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation GISCafe - Geographical Information Services TechJobsCafe - Technical Jobs and Resumes ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise