Technology, Economics and Electronics to Converge at IPC Technology Market Research Conference (TMRC)

BANNOCKBURN, Ill., USA, September 17, 2013 — Industry thought leaders will present a high-level look at new technologies against a backdrop of domestic and global economics during the IPC Technology Market Research Conference (TMRC), September 25–26 in Chicago. The conference aims to give attendees a holistic perspective on the technologies and economic forces that will shape the electronics marketplace in the near term.

Expert insights at the event may challenge existing paradigms.

I think that in the near term most global growth is going to come from the developed countries of North America, Western Europe and Japan,” said Robert Fry, Ph.D., senior economist at DuPont. “There has been a significant downshift in growth in the emerging markets of Asia, and many of these countries — China in particular — will never return to the rapid growth rates they experienced over the last few decades.” Fry will expand on these ideas during his session on the global economic outlook at the TMRC.

On the technology side, 3-D packaging is among the timely topics on the agenda. Although many forms of 3-D packaging have been adopted in today’s electronic products, the ultimate form of 3-D — in which ICs are stacked using through silicon vias (TSVs) — is in the not-too-distant future, according to Jan Vardaman, president of TechSearch International.

As with the adoption of any new technology, cost is the limiting factor," Vardaman said. “Some high performance applications, such as 3-D stacked memory with TSVs, appear to be on the horizon.

Several companies are developing new materials and equipment for 3-D IC with TSVs. Vardaman believes that, in the interim, some module solutions using interposers with multiple die may meet the immediate form factor and performance objectives. She will discuss the latest developments in this new module technology and its timeline toward wide adoption during her presentation at the TMRC.

Nanotechnology, automotive technology, new materials, military markets and China’s PCB industry will also be highlighted at the event. In addition, attendees will hear from New York Times columnist Gene Marks during his opening keynote about economic, political and other trends influencing businesses today.

The TMRC is co-located with IPC Management Meetings, which will take place on September 24. More information about the TMRC, including a full agenda and registration options, is available at  www.ipc.org/tmrc.

About IPC

IPC ( www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,300 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2.17 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; Bangkok, Thailand; and Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.  


Contact: 

Anna Garrido,
IPC Director of Marketing and Communications
+1 847-597-2804
Email Contact




Review Article Be the first to review this article
HP

SolidCAM: Program your CNCs directly inside your existing CAD system.

Featured Video
Jobs
Inside Sales for SolidCAM at Newtown, PA
Director of Mechanical Engineering for Velodyne LIDAR at Morgan Hill, CA
Sr. GIS Technical Analyst for Southern California Edison SCE Transmission and Distribution Organization at Rosemead, CA
Project Architect for LAMBERT Architecture and Interiors at Winston-Salem, NC
Data Scientist for University of Utah at Salt Lake City, UT
Architetural Project Manager for DRA Architects at Irvine, CA
Upcoming Events
DriveWorks World at The Barley Store Laskey Lane Thelwall Cheshire United Kingdom - Mar 6 - 9, 2017
JEC World 2017 at Paris Nord Villepinte Exhibition Centre Paris France - Mar 14 - 16, 2017
SOLIDWORKS funding event – Leicester at The National Space Centre, Exploration Dr, Leicester, LE4 5NS Leicester United Kingdom - Mar 17, 2017
ACE 2017 Nashville at Nashville TN - Mar 21 - 23, 2017



Internet Business Systems © 2017 Internet Business Systems, Inc.
595 Millich Dr., Suite 216, Campbell, CA 95008
+1 (408)-337-6870 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation GISCafe - Geographical Information Services TechJobsCafe - Technical Jobs and Resumes ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy Policy Advertise