STMicroelectronics Unveils New Pressure Sensor Technology

GENEVA -- (Marketwired) -- Jul 30, 2013 -- STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, the world's top MEMS (Micro-Electro-Mechanical Systems) manufacturer, and the leading supplier of MEMS sensors for consumer and portable applications(1), has announced a new, ST-patented technology that isolates the pressure-sensing element within a fully molded package to meet the ultra-small form factor requirements and design creativity for the next generation of portable consumer devices.

Integrating the isolated pressure-sensing element in a fully molded package, this unique technology enables fully encapsulated wire bonding with zero risk of corrosion, elimination of wire bonding damage during pick and place assembly, zero risk of cap detachment or cap damage while the device is being mounted, and no impact on the sensor from the soldering process to ensure a more robust packaging solution.

According to market analysts Yole Développement(2), the MEMS pressure sensor market will grow from $1.9B in 2012 to $3B in 2018. MEMS pressure sensors for consumer applications, especially for smartphones and tablets, will represent 1.7 billion units and will overtake automotive as the leading target application for MEMS, adding 8% CAGR to the global MEMS pressure sensor market. ST has over 800 MEMS-related patents and patent applications worldwide and as the world's top MEMS manufacturer, has a production capacity of 4 million devices per day and has shipped more than three billion MEMS devices.

"This technology represents a revolution in the enhancement of performance and quality for pressure sensors. STMicroelectronics pioneered the use of fully molded packages without gel for high volume manufacturing for Accelerometers and Gyroscopes," said Benedetto Vigna, Executive Vice President, General Manager, Analog, MEMS & Sensors Group, STMicroelectronics. "We are now leveraging this knowledge to revolutionize the packaging in the emerging field of pressure sensors where STMicroelectronics is the first to use a fully molded package without gel for a high performance pressure sensor with enhanced accuracy."

The new technology enhances accuracy (+/- 0.2 mbar) while continuing to offer zero drift, low noise (0.010 mbar RMS) and a simplified calibration system, making it ideal for a broad range of consumer, automotive and industrial applications including indoor/outdoor navigation, location-based services, enhanced GPS dead-reckoning, altimeter and barometer functions, weather station equipment, and healthcare applications.

About STMicroelectronics
ST is a global leader in the semiconductor market serving customers across the spectrum of sense and power and automotive products and embedded processing solutions. From energy management and savings to trust and data security, from healthcare and wellness to smart consumer devices, in the home, car and office, at work and at play, ST is found everywhere microelectronics make a positive and innovative contribution to people's life. By getting more from technology to get more from life, ST stands for life.augmented.

In 2012, the Company's net revenues were $8.49 billion. Further information on ST can be found at www.st.com.

(1) IHS: MEMS H2 2012 Special Report
(2) Yole Développement: MEMS Pressure Sensor 2013

STMicroelectronics Pressure Sensor Technology: http://hugin.info/152740/R/1719700/572373.pdf

For Press Information Contact:
STMicroelectronics
Michael Markowitz
Director Technical Media Relations
+1 781 591 0354

Email Contact 





Review Article Be the first to review this article

Autodesk University 2017

Featured Video
Editorial
Jeff RoweJeff's MCAD Blogging
by Jeff Rowe
PTC Marches On With New Vuforia AR Platform Release
Jobs
Vice President, Transportation Services for Associated General Contractors of New York State at Albany, NY
Architectural Designer for Champion Home Builders at Troy, MI
GIS Software Developer for SoCalGas at Los Angeles, CA
GIS Analyst for G2 Partners LLC at San Ramon, CA
GIS Software Developer for UDC at Englewood, CO
Upcoming Events
ASSESS 2017 CONGRESS at Bolger Center Potomac MD - Nov 1 - 3, 2017
FABTECH 2017 at McCormick Place Chicago IL - Nov 6 - 9, 2017
ATX MINNEAPOLIS 2017 at Minneapolis MN - Nov 8 - 9, 2017
2017 China Chongqing International Machine Tool Show (CCIMT) at Chongqing International Expo Center, Yubei Chongqing China - Nov 13 - 16, 2017



Internet Business Systems © 2017 Internet Business Systems, Inc.
25 North 14th Steet, Suite 710, San Jose, CA 95112
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation GISCafe - Geographical Information Services TechJobsCafe - Technical Jobs and Resumes ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise