Nimbic Founder Dr. Vikram Jandhyala to Keynote Session on “Cloud-Based Scalable Electromagnetic Solvers for 3D Package Modeling”

MOUNTAIN VIEW, CA  – Tuesday, May 21, 2013 – Nimbic, the leading provider of 3D Full-Wave Electromagnetic Simulation and Secure  EDA Cloud-Computing solutions, today announced that Dr. Vikram Jandhyala, Founder, Nimbic, will keynote a session titled “Cloud-Based Scalable Electromagnetic Solvers for 3D Package Modeling” at ECTC 2013 - IEEE Electronic Components and Technology Conference.

The premier international packaging, components, and microelectronic systems technology conference, the Electronic Components and Technology Conference (ECTC), strives to offer attendees an outstanding array of packaging technology information. The 2013 conference in Las Vegas has 36 technical sessions, 4 interactive presentation sessions, 1 student poster session, 16 professional development courses, two panel discussions, a plenary session, a CPMT Seminar, a special modeling session, and a technology corner for exhibitors.

The demands in systems for smart/multiple functions and high performance have been driving electronic packaging to implement 3D/Stack/TSV integration. Virtual design and prototyping of the 3D system, with the help of modeling and simulation, become critical for design optimization, guiding the process, and preventing unexpected failures. Meanwhile, the actual 3D system design and processes are so complicated that they challenge the current simulation methodologies and tools. This special session will provide a forum for experts in electrical, thermal and mechanical modeling fields to cover various 3D system packaging levels from 3D processes, materials, TSV, and wafer stacking. The presentations and discussions range from thermo-mechanical challenges for 3D system processes, critical design parameters of TSV stacking, to electrical simulation for signal and power integrity, electrical and thermal integrity optimization, and cloud-based scalable solutions for 3D system modeling.

WHAT: Cloud-Based Scalable Electromagnetic Solvers for 3D Package Modeling
WHERE: Cosmopolitan of Las Vegas
WHEN: Tuesday, May 28, 2013, 2.30pm – 4.30pm
WHO: Dr. Vikram Jandhyala, Nimbic & University of Washington

For additional information on the panel, visit  http://www.ectc.net/program/63-ECTCAdvance-Web.pdf

About Nimbic

Nimbic is the leading provider of Maxwell-accurate, 3D Full-Wave  Electromagnetic Simulation and  Cloud-Based Scalable EDA solutions. Nimbic’s nWave 3D field solver enables signal integrity, power integrity and EMI analysis for chip-package-board design. Nimbic’s nCloud scalable cloud compute platform facilitates em integrity analysis for complex designs cost-effectively and in near real time. Nimbic’s customers include Texas Instruments, Renesas, nVidia, Toshiba, Qualcomm & Panasonic. Nimbic is headquartered at 2063 Landings Drive, Mountain View, CA.

For additional information, please visit  www.nimbic.com

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Media Contact:

Bala Vishwanath, Chief Marketing Officer, Nimbic 800-686-5213  Email Contact



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