ARM and Cadence Partner to Implement Industry's First Cortex-A57 64-bit Processor on TSMC 16nm FinFET Process

Ongoing Collaboration Delivers Innovative Solutions Featuring Co-Optimization of Process, IP and Design Automation

CAMBRIDGE, UNITED KINGDOM and SAN JOSE, CA, April 04, 2013 (Marketwired)-- Cadence Homepage Fulfilling the promise of performance and power scaling at 16 nanometers, ARM (LSE: ARM) (NASDAQ: ARMH) and Cadence (NASDAQ: CDNS) today announced details behind their collaboration to implement the first ARM® Cortex®-A57 processor on TSMC's 16-nanometer (nm) FinFET manufacturing process. The test chip was implemented using the complete Cadence RTL-to-signoff flow, Cadence Virtuoso custom design platform, ARM Artisan® standard cell libraries and TSMC's memory macros.

The Cortex-A57 processor is ARM's highest-performing processor to date, and is based on the new ARMv8 architecture, designed for computing, networking and mobile applications that require high performance at a low-power budget. TSMC's 16nm FinFET technology is a significant breakthrough that enables continued scaling of process technology to feature sizes below 20nm. This test chip, developed with Cadence's custom, digital and signoff solutions for FinFET process technology, was a collaboration that resulted in several innovations and co-optimizations between manufacturing process, design IP, and design tools.

"More than ever, success at the leading edge of innovation requires deep collaboration. When designing SoCs incorporating advanced processors, like the Cortex-A57, and optimizing the implementation using physical IP created for FinFET processes, the expertise of our partners is needed," said Tom Cronk, executive vice president and general manager, Processor Division at ARM. "Our joint innovations will enable our customers to accelerate their product development cycles and take advantage of leading-edge processes and IP."

The 16nm process using FinFET technology presented new challenges that required significant new development in the design tools. New design rules, RC extraction for 3D transistors, increased complexity of resistance models for interconnect and vias, quantized cell libraries, library characterization that supports new transistor models and double patterning across more layers are some of the challenges that have been addressed in Cadence's custom, digital and signoff products.

"This major milestone was challenging on all fronts, requiring engineers from ARM, Cadence and TSMC to work as a unified team," said Dr. Chi-Ping Hsu, senior vice president of R&D for the Silicon Realization Group at Cadence. "Our combined efforts and commitment to innovation will enable our customers to adopt the next generation of IP, process and design technology for designing high performance, low-power SoCs."

About ARM

ARM designs the technology that is at the heart of advanced digital products, from wireless, networking and consumer entertainment solutions to imaging, automotive, security and storage devices. ARM's comprehensive product offering includes RISC microprocessors, graphics processors, video engines, enabling software, cell libraries, embedded memories, high-speed connectivity products, peripherals and development tools. Combined with comprehensive design services, training, support and maintenance, and the company's broad Partner community, they provide a total system solution that offers a fast, reliable path to market for leading electronics companies. Find out more about ARM by following these links:

About Cadence
Cadence enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software, hardware, IP, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available at www.cadence.com.


Contacts:

Dean Solov,
Cadence Design Systems, Inc.
Tel.: 408-944-7226
Email Contact

Phil Hughes,
ARM,
Tel.: 512-330-1844
Email Contact




Review Article Be the first to review this article

Featured Video
Editorial
Jeff RoweJeff's MCAD Blogging
by Jeff Rowe
Siemens Goes ECAD With Mentor Graphics Acquisition
Jobs
Mechanical Engineer for IDEX Corporation at West Jordan,, UT
Senior Structural Engineer for Design Everest at San Francisco, CA
GIS Analyst II for Air Worldwide at Boston, MA
Business Partner Manager for Cityworks - Azteca Systems, LLC at Sandy, UT
Upcoming Events
Design & Manufacturing, Feb 7 - 9, 2017 Anaheim Convention Center, Anaheim, CA at Anaheim Convention Center Anaheim CA - Feb 7 - 9, 2017
Innorobo 2017 at Docks de Paris Paris France - May 16 - 18, 2017
Display Week 2017 at Los Angeles Convention Center 1201 S Figueroa St Los Angeles CA - May 21 - 26, 2017



Internet Business Systems © 2016 Internet Business Systems, Inc.
595 Millich Dr., Suite 216, Campbell, CA 95008
+1 (408)-337-6870 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation GISCafe - Geographical Information Services TechJobsCafe - Technical Jobs and Resumes ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy Policy Advertise