IPC Issues Call for Participation for 2014 IPC APEX EXPO

BANNOCKBURN, Ill., USA, April 3, 2013 --  IPC – Association Connecting Electronics Industries® invites researchers, academics, technical experts and industry leaders to submit abstracts for the 2014 IPC APEX EXPO® at the Mandalay Bay Resort and Convention Center in Las Vegas. The technical conference will be held March 25-27, 2014, and the professional development courses will be held March 23, 24 and 27, 2014.

The world’s premier conference and exhibition for the electronic interconnect industry, IPC APEX EXPO provides presenters and their companies with a notable and cost-effective opportunity to promote their expertise and gain visibility with key engineers, managers and executives from all segments of the industry worldwide. To recognize exceptional achievement, awards will be presented for “Best U.S. Paper” for U.S. authors and “Best International Paper” for authors outside the United States.

Expert presentations are being sought on design, materials, assembly, processes and equipment in the following areas:

  • Adhesives 
  • Advanced Technology 
  • Area Array/Flip Chip/0201
  • Assembly and Rework Processes
  • BGA Packaging
  • Black Pad and other Board Related Issues
  • Business & Supply Chain Issues 
  • BTC/QFN/MLF 
  • Conformal coatings 
  • Counterfeit Electronics 
  • Design 
  • Electromigration 
  • Electronics Manufacturing Services 
  • Embedded Passive & Active Devices
  • Environmental Compliance
  • Flexible Circuitry
  • Head-in-Pillow, Component & Board Warpage
  • Lean Six Sigma
  • HDI Technologies
  • High Speed, High Frequency & Signal Integrity 
  • Lead Free Fabrication, Assembly & Reliability 
  • Microminiaturization 
  • Nanotechnology 
  • Optoelectronics 
  • Packaging & Components 
  • PoP

 

  • PCB Fabrication
  • PCB and Component Storage & Handling
  • Performance, Quality & Reliability
  • Photovoltaics
  • Printed Electronics
  • RFID Circuitry
  • Soldering
  • Surface Finishes
  • Test, Inspection & AOI
  • Tin Whiskers
  • Underfills
  • Via Plugging & Other Protection 
  • 2.5D/3D Packaging

A 300-word technical conference abstract summarizing original and previously unpublished work covering case histories, research and discoveries must be submitted. The submission should describe significant results from experiments, emphasize new techniques, discuss trends of interest and contain technical and/or appropriate test results. In addition, course proposals are solicited from individuals interested in presenting half-day professional development courses on design, manufacturing processes and materials. Reimbursement for travel expenses and an honorarium are offered to course instructors.

Both the technical conference paper abstracts and course proposals are due May 4, 2013. To submit an abstract or proposal, visit www.IPCAPEXEXPO.org/CFP.

For more information about conference presentations, contact Jasbir Bath, IPC conference director, at Email Contact or Toya Richardson, IPC technical programs coordinator, at Email Contact.

For more information about half-day professional development courses, contact Susan Filz, IPC director of industry programs and professional development, at Email Contact

About IPC

IPC ( www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,300 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2.17 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; Bangkok, Thailand; and Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China. 


Contact:

Anna Garrido,
IPC Director of Marketing and Communications
Tel.: +1 847-597-2804 
Email Contact 




Review Article Be the first to review this article

Featured Video
Jobs
Associate Packaging Engineer for Unilever at Englewood Cliffs, New Jersey
BIM / REVIT Senior Structural Modeler for McNamara Salvia at New York, California
Senior Account Manager, Utilities for RAMTeCH Software Solutions, Inc. at Stillwater, Minnesota
GIS Engineer III for Nebraska State Government at Lincoln|, Nebraska
Vice President, GIS Business Unit for RAMTeCH Software Solutions, Inc. at Stillwater, Minnesota
Upcoming Events
COMSOL Conference 2018 Lausanne at SwissTech Convention Center Quartier Nord EPFL, Route Louis-Favre 2, 1024 Ecublens Switzerland - Oct 22 - 24, 2018
6th OpenFOAM Conference 2018 at Radisson Blu Hotel, Hamburg Airport Flughafenstraße 1-3 Hamburg Germany - Oct 23 - 25, 2018
ASSESS 2018 CONGRESS at Chateau Elan Winery & Resort 100 Rue Charlemagne, Braselton GA - Oct 28 - 30, 2018
MEMS & Sensors Executive Congress—MSEC 2018 at Silverado Resort and Spa 1600 Atlas Peak Road Napa CA - Oct 28 - 30, 2018
Kenesto: 30 day trial
SolidCAM: See It Live



Internet Business Systems © 2018 Internet Business Systems, Inc.
25 North 14th Steet, Suite 710, San Jose, CA 95112
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation GISCafe - Geographical Information Services TechJobsCafe - Technical Jobs and Resumes ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise