Toshiba Adds Triac Output Photocouplers to Product Lineup

Reinforced Insulation Enables New TLP265J and TLP266J to Meet International Safety Standards

IRVINE, Calif., March 12, 2013 — (PRNewswire) — Toshiba America Electronic Components, Inc., (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, has announced the addition of the 600V TLP265J and TLP266J to its extensive lineup of photo triac couplers.  They are ideal for applications such as triac drivers, programmable controllers, AC output modules, and solid-state relays.

The TLP265J consists of a non-zero crossing photo triac, and the TLP266J consists of a zero crossing photo triac, and both are optically coupled to a gallium arsenide infrared emitting diode. Using a SO6 double-mold package, the TLP265J and TLP266J achieve reinforced insulation at an isolation voltage of 3750Vrms (AC, 1 minute). Having obtained the UL, cUL, and VDE approvals for creepage distance and clearing distance (5mm, min.), the TLP265J and TLP266J meet the reinforced insulation class requirements of international safety standards.

In terms of electrical characteristics, the new triac couplers support up to 7 mA of trigger LED current, which allows for output control at a lower input current - thus contributing to lower power consumption. Support of reflow mounting in accordance with JEDEC standards makes the TLP265J and TLP266J easy to use, and long-life LEDs increase design flexibility.

Features of the TLP265J and TLP266J include:

  • Reinforced insulation, support of mounting in accordance with the JEDEC standard, IFT7
  • UL, cUL and VDE approvals
  • Peak off-state voltage: 600V (min)
  • Trigger LED current: 10 mA (max); IFT7 version: 7 mA (max)
  • On-state current: 70 mA (max)

Main Specifications of NZC Triac Couplers: TLP265J


Existing Product


New Product





Peak OFF-state output

terminal voltage VDRM [V]





Trigger LED current IFT [mA]


10, 7

On-state RMS current IT [mA]



Isolation voltage BVS [Vrms]




Structural Parameters [mm]

Creepage distance



Clearance distance



Insulation thickness



1 | 2 | 3  Next Page »

Review Article Be the first to review this article

Featured Video
Mid-Level Mechanical Engineer for Kiewit at lenexa, Kansas
Director of Process Engineering. for Tekni-Plex at Toledo, Ohio
Mechanical Engineer for Allen & Shariff Corporation at Pittsburgh, Pennsylvania
System Designer/Engineer for Bluewater at Southfield, Michigan
Senior Structural Engineer for Wiss,Janney, Estner Assoicates, Inc at houston, Texas
SENIOR GIS GAS SPECIALIST for James W. Sewall Company at , Any State in the USA
Upcoming Events
ACE 2018 Conference at The Westin Indianapolis 241 W Washington St Indianapolis IN - Mar 20 - 22, 2018
ESPRIT World 2018 at Indianapolis Marriott Downtown 350 West Maryland Street Indianapolis IN - Jun 11 - 15, 2018
HxGN LIVE 2018 at The Venetian Las Vegas NV - Jun 12 - 15, 2018
IMTS2018 International Manufacturing Tech Show at McCormick Place Chicago IL - Sep 10 - 15, 2018
Kenesto: 30 day trial

Internet Business Systems © 2018 Internet Business Systems, Inc.
25 North 14th Steet, Suite 710, San Jose, CA 95112
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation GISCafe - Geographical Information Services TechJobsCafe - Technical Jobs and Resumes ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise