MagnaChip Introduces a Step-Down DC/DC Converter for Smartphone Power Amplifier Applications

SEOUL, South Korea and CUPERTINO, Calif., March 11, 2013 — (PRNewswire) — �MagnaChip Semiconductor Corporation ("MagnaChip") (NYSE: MX), a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, today announced that it has introduced a step-down DC/DC converter (model: MAP7153) designed to improve smartphone power amplifier performance and efficiency.

The MAP7153 optimizes power efficiency and extends smartphone battery life by converting output voltage into bypass or high voltage while operating in high power mode, or into low voltage while in low power mode.

The MAP7153 features fast transition time, excellent line and load regulation, and minimum footprint as a result of its reduced die size and small 1.32mm x 1.27mm WLCSP package. Two switching frequencies are also selectable in the MAP7153.  A 3 MHz option provides improved efficiency while a 6 MHz option saves printed circuit board space by utilizing smaller inductors.

"Customers are demanding increased performance and power efficiency from their smartphones," said H.K. Kim, EVP and General Manager of MagnaChip's Display and Power Solutions Divisions. "By incorporating our MAP7153 into their designs, smartphone manufacturers can continue to provide new and improved products that significantly enhance energy efficiency and battery capacity in the fast growing smartphone market."

About MagnaChip Semiconductor
Headquartered in South Korea, MagnaChip Semiconductor is a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products for high volume consumer applications. MagnaChip Semiconductor believes it has one of the broadest and deepest range of analog and mixed-signal semiconductor platforms in the industry, supported by its 30-year operating history, a large portfolio of registered and pending patents, and extensive engineering and manufacturing process expertise. For more information, please visit www.magnachip.com.

CONTACTS


In the United States:

Robert Pursel

Director of Investor Relations

Tel. +1-408-625-1262

robert.pursel@magnachip.com

In Korea:

Chankeun Park

Senior Manager, Public Relations

Tel. +82-3-6903-3195

chankeun.park@magnachip.com

 

SOURCE MagnaChip Semiconductor Corporation

Contact:
MagnaChip Semiconductor Corporation
Web: http://www.magnachip.com




Review Article Be the first to review this article
HP

Featured Video
Jobs
Senior Mechanical Engineer for Verb Surgical at Mountain View, CA
Principal Research Mechatronics Engineer for Verb Surgical at Mountain View, CA
CAD Systems Administrator for KLA-Tencor at Milpitas, CA
Industrial Designer Intern – Spring 2017 for Nvidia at Santa Clara, CA
Lead Geospatial Analyst for Alion at McLean, VA
Upcoming Events
SOLIDWORKS 2017 Launch Event – Walsall at Village Hotel Club, Walsall, WS2 8TJ Walsall United Kingdom - Mar 30, 2017
PI APPAREL Hong Kong 2017 at SHANGRI-LA KOWLOON 64 Mody Road Tsim Sha Tsui East Kowloon Hong Kong - Apr 5 - 6, 2017
SOLIDWORKS intro and hands on session – Slough at Baylis House, Slough, Berkshire, SL1 3PB Slough United Kingdom - Apr 7, 2017
Engineer 3D! Training + Technology Conference at Hyatt Regency Milwaukee 333 West Kilbourn Avenue Milwaukee WI - Apr 25 - 26, 2017
SolidCAM: Patented Wizard to optimal feeds & speeds
MasterCAM



Internet Business Systems © 2017 Internet Business Systems, Inc.
595 Millich Dr., Suite 216, Campbell, CA 95008
+1 (408)-337-6870 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation GISCafe - Geographical Information Services TechJobsCafe - Technical Jobs and Resumes ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy Policy Advertise