BANNOCKBURN, Ill., USA, February 12, 2013 — Hundreds of experts from around the world will discuss electronics manufacturing standards in more than 80 standards meetings February 16–22, in conjunction with IPC APEX EXPO® in San Diego.
Facilitated by representatives from OEMs, PCB manufacturers, EMS providers, design firms, and other organizations, the IPC committees establish benchmarks for excellence in printed board design, as well as assembly and joining processes and product reliability and testing.
According to Dave Torp, IPC vice president of standards and technology, industry standards enable companies to negotiate commerce and they contribute directly to the success of the industry as a whole.
“Implementing IPC standards ensures reliability and quality in an organization,” Torp said. “Through standards meetings, everyone in the industry can engage in an exchange of ideas about current industry trends as well as the identification of new standards and updating of current ones. These standards help our member companies improve quality, communication and cost-savings.”
Standards development committee meetings will cover industry benchmarks in assembly and joining; base materials; cleaning and coating electronic documentation technology; electronic product data description; embedded devices; environment, health and safety; fabrication processes; flexible and rigid-flex printed boards; high speed/high frequency interconnections; management; packaged electronics components; printed electronics; process control; product assurance; product reliability; rigid printed boards; terms and definitions; and testing.
For more information on IPC APEX EXPO and its standards development activities, or to register, visit
www.IPCAPEXEXPO.org. For more information on all IPC standards development activities, visit
IPC Director of Marketing and Communications
(P.:) +1 847-597-2804