Toshiba to Launch Audio Codec IC for Mobile Devices

Proprietary single microphone noise/echo cancellation technology realizes high-quality voice during hands-free calling

TOKYO — (BUSINESS WIRE) — February 12, 2013Toshiba Corporation (TOKYO:6502) today announced that it will launch an audio codec IC that integrates the audio features required for mobile devices, such as smartphones and tablets, including microphone input, an earpiece speaker amplifier, stereo headphone amplifier and line-out output. Samples of the new product, TC94B24WBG, are available now and mass production is scheduled for March 2013.
Toshiba's proprietary single microphone noise/echo cancellation technology applied in the TC94B24WBG realizes high-quality voice on mobile devices during hands-free calling, for such situations as video telephony.

Toshiba Audio Codec IC for Mobile Devices (Photo: Business Wire)

Toshiba Audio Codec IC for Mobile Devices (Photo: Business Wire)

Key Features

1. Toshiba's proprietary single microphone noise/echo cancellation technology
2. Integrated earpiece speaker amplifier, headphone amplifier and line-out output
3. Integrated audio post-processing features (equalizer, dynamic range controller)
4. Programmable DSP core: CEVA-TeakLite-ⅢTM[1]
[1] CEVA-TeakLite-ⅢTM is a trademark of CEVA, Inc.

Applications

Audio processing for mobile devices such as smartphones and tablets.

Main specifications

*Part Number: TC94B24WBG

*4-channel digital microphone interface
*2-channel A/D converter for analog microphone input
*Class-G headphone amplifier, earpiece speaker amplifier, line amplifier
*Asynchronous sampling rate converter (for single stereo channel):
8 kHz to 48 kHz sampling rates
* Audio DSP: Volume control, sound mixing, MUX
- During phone calls:
Single microphone noise and echo cancellation
- During playback of audio:
Equalizer, dynamic range control
*I2S audio interface: 4 input/output ports
*I2C bus interface with support for fast mode (400 kHz)/SPI interface mode (1 MHz)
*Package: WCSP 79-ball 0.5mm pitch
 

*Follow this link for more on this product.
http://www.semicon.toshiba.co.jp/eng/product/assp/selection/audio/mobile_portable/tc94b24wbg.html

 
Information in this document, including product prices and specifications, content of services and contact information, is current on the date of the announcement but is subject to change without prior notice.
 

1 | 2  Next Page »



Review Article Be the first to review this article
Rand3D

SolidCAM: SolidCAM Dec 2017 Campaign Save 28 percent

Featured Video
Jobs
Sr Mechanical Design Engineer for Medtronic at mounds view, MN
Mechanical Design Engineer 3 for KLA-Tencor at Milpitas, CA
Geospatial Systems Administrator for BAE Systems Intelligence & Security at arnold, MO
Urban Designer - Urban Design/Planning for SERA Architects, Inc at Portland, OR
Senior Mechanical Engineer for BAE Systems Intelligence & Security at Arlington, VA
Geospatial Analyst - Senior for BAE Systems Intelligence & Security at Springfield, VA
Upcoming Events
ESPRIT World 2018 at Indianapolis Marriott Downtown 350 West Maryland Street Indianapolis IN - Jun 11 - 15, 2018
HxGN LIVE 2018 at The Venetian Las Vegas NV - Jun 12 - 15, 2018
IMTS2018 International Manufacturing Tech Show at McCormick Place Chicago IL - Sep 10 - 15, 2018
Kenesto: 30 day trial



Internet Business Systems © 2017 Internet Business Systems, Inc.
25 North 14th Steet, Suite 710, San Jose, CA 95112
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation GISCafe - Geographical Information Services TechJobsCafe - Technical Jobs and Resumes ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise