Virtex-7 2000T FPGA honored for use of stacked silicon interconnect technology to deliver ultra high-density 3D devicesSAN JOSE, Calif., July 12, 2012 — (PRNewswire) — �Xilinx, Inc. (NASDAQ: XLNX) today announced it has been honored by ElectroniqueS Magazine with their Electron d'Or award for the best Programmable Logic product of 2012. The Virtex®-7 2000T FPGA, the world's first FPGA using Xilinx stacked silicon interconnect (SSI) technology, was recognized by a panel of industry experts and editors of France's leading electronics publication who awarded products and technologies that have made the largest impact on the industry during the year.
Virtex-7 2000T FPGAs enabled by SSI technology deliver 2 million logic cells, 6.8 billion transistors, and 12.5 Gb/s serial transceivers on a single 3D device. SSI technology allows multiple FPGA die to be combined in a single package to deliver more of the FPGA resources (logic, memory, serial transceivers and processing elements) to meet customer design requirements. This breakthrough technology provides the next level of advanced system integration for applications that require high-logic density and highest performance, while accelerating design productivity.
Presented in Paris on June 20, the editorial team recognized the best technology innovations in 14 separate categories. The Virtex-7 2000T device using SSI technology permits designs requiring increased capacity and programmable system integration that are at least one process generation ahead of comparable monolithic devices and previously possible only in ASICs.
"We are delighted to receive this award for our multi-die 3D All Programmable Virtex-7 2000T devices, which break the limits of Moore's Law by using SSI technology," said Liam Madden, corporate vice president of FPGA development and silicon technology at Xilinx. "The Virtex-7 2000T FPGA delivers cell density well beyond the technical limit of a 28nm monolithic device, providing more than double the density of the nearest competing programmable device."
Xilinx SSI technology utilizes microbumps fabricated on the 28nm FPGA die to interface to a silicon interposer built using low-risk, high-yield 65nm technology. Four separate 28nm FPGA die are connected to the interposer, which has four layers of metallization providing tens of thousands of high-bandwidth, low-latency interconnects that connect the die together so they operate as one. Through-Silicon Vias connects off-chip I/Os to controlled-collapse solder balls on the opposite side of the interposer, and the assembly is attached to the BGA package substrate as a flip-chip. This produces an FPGA device that delivers two times the capacity for much higher levels of integration compared to monolithic devices. Since such a device would not be available until at least one process generation (typically two years) later using conventional approaches, this technology provides a competitive advantage for Xilinx customers.
The Virtex-7 2000T, Virtex-7 X1140T, Virtex-7 H580T FPGAs and similar multi-die SSI based devices in the Virtex-7 T, Virtex-7 XT and Virtex-7 HT series enable engineers to significantly increase application performance and design productivity by adding new functionality to existing designs, consolidating multi-FPGA designs into a single device, or starting early prototyping of system emulators using the largest FPGAs. As an all programmable alternative to large-capacity ASICs and ASSPs, these FPGAs can be designed and brought to market in a fraction of the time.
Xilinx is the world's leading provider of All Programmable FPGAs, SoCs and 3D ICs. These industry-leading devices are coupled with a next-generation design environment and IP to serve a broad range of customer needs, from programmable logic to programmable systems integration. For more information, visit www.xilinx.com.
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SOURCE Xilinx, Inc.