Multiple Standards Being Developed to Enable 2.5D and 3D Design Flows
AUSTIN, Texas — (BUSINESS WIRE) — May 31, 2012 — The Silicon Integration Initiative (Si2) announced today six additional members of their Open3D Technical Advisory Board (TAB), which is chartered to enable interoperable 2.5D and 3D design flows with open standards, providing common formats and interfaces. The new members of the Open3D TAB are: Altera, AMD, IBM, Helic S.A., SEMATECH, and STARC. There are now 18 companies and organizations participating in the Open3D TAB.
Current working groups for Open3D TAB members include developing standards to support:
- Definition of the power distribution network across the die of a 3D stack, a topic for which a contribution has already been received in response to the request for technology (RFT) that was released earlier in the year
- Thermal design and analysis of an entire 3D stack, including thermal constraints between neighboring dies
- Expression of design constraints into and out of the path-finding and floorplanning stage of the overall design process
“3D implementation presents difficult and complex challenges that will require the development and adoption of standards,” said Raj Jammy, SEMATECH's vice president of Emerging Technologies. “This partnership aims to fill that space with a complementary effort to enable successful commercialization of 3D ICs.”
“The Open3D TAB is making excellent progress and gaining significant momentum, as evidenced by the new members who have recently joined the TAB,” said Dr. Sumit DasGupta, Sr. Vice President of Engineering, Si2. “Member companies have made key technical donations in areas such as the Chip Interface Protocol description for power distribution network analysis from ANSYS and the requirements documents from SRC for power distribution networks and thermal analysis. We invite others in the industry to join this effort.”
At the upcoming Design Automation Conference in San Francisco, Si2 will be presenting a session on “Standards for a 3D World.” This will be on June 4 in Room 301 of the Moscone Center from 3:15 PM – 4:30 PM. This session will include a presentation of status of activities in the 3DTAB followed by a panel discussion which will include industry experts who will present some of the issues being addressed now and also cover some of the future challenges. For more information and free registration, click here: http://www.si2.org/?page=1525
For more information on the Open3D TAB, click here: http://www.si2.org/?page=1380
Membership in Si2 project is open to all interested parties across the semiconductor supply chain. For more information see: http://www.si2.org/?page=1137
Open3D TAB Members:
Altera (NASDAQ: ALTR), AMD (NYSE: AMD), ANSYS (NASDAQ: ANSS), Atrenta, Cadence Design Systems (NASDAQ: CDNS), Fraunhofer Institute, GLOBALFOUNDRIES, IBM (NYSE: IBM), Intel (NASDAQ: INTC), Helic S.A., Invarian, Mentor Graphics (NASDAQ: MENT ), Qualcomm (NASDAQ: QCOM), R3Logic, SEMATECH, STARC, STMicroelectronics (NYSE: STM), and Texas Instruments (NYSE: TXN).
Si2 is the largest organization of industry-leading semiconductor, systems, EDA and manufacturing companies focused on the development and adoption of standards to improve the way integrated circuits are designed and manufactured, in order to speed time-to market, reduce costs, and meet the challenges of sub-micron design. Now in its 24th year, Si2 is uniquely positioned to enable timely collaboration through dedicated staff and a strong implementation focus driven by its member companies. Si2 represents over 90 companies involved in all parts of the silicon supply chain through out the world. See: www.si2.org.
Silicon Integration Initiative
William Bayer, 512-342-2244, ext. 304