Improve Collaboration...Foster Innovation for your Organization (3D CIC)

The 3D Collaboration & Interoperability Congress (3DCIC) is dedicated to fostering and improving collaboration and interoperability in product design, development and manufacturing. Now in its ninth year, the annual Congress is the only vendor- and product-neutral event in the world addressing collaboration and interoperability in manufacturing and business communications. The international event has grown into an essential forum for executives, managers, senior engineers, and IT professionals to network, learn and strategize with thought leaders from automotive, aerospace and many other manufacturing industries, as well as with representatives from government and defense communities.

The 2012 CIC will be held May 21-23 in Denver, Colorado at the Inverness Hotel and Conference Center. Registration is now open. Visit www.3DCIC.com to register or to learn more about the event. Presentations and audios from recent past events are also available for free at the web site.

This year’s agenda is among the best ever. In addition, the Board of Directors of PDES, the group that manages STEP, will hold their annual board meeting at 3DCIC. The 3D PDF Consortium will also hold their first annual meeting at 3DCIC. And the DoD’s MBE/MBD leadership will hold a workshop. This means many of the world’s leaders in visualization, collaboration and interoperability will be at 3DCIC this year.

The CIC event has rapidly grown into an essential forum for executives, managers, senior engineers, and IT vendors. The dialogue at CIC has become a yearly barometer of the state of collaboration and interoperability, which have such a huge impact on PLM success and overall productivity across all sectors of manufacturing. Register now at time-limited early discounted rates.

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