The latest version of the world’s leading product data exchange automation software is now available
Milford, OH, February 20, 2012 – ITI TranscenData is pleased to announce the immediate availability of DEXcenterTM 6.2. DEXcenter supports the growing movement toward Model Based Environments by offering a vendor-neutral platform that automates CAD/CAM/CAE/PLM interoperability workflows and provides secure managed file transfer. DEXcenter is currently in production providing customer supplier interoperability for major manufacturers worldwide.
New capabilities available in DEXcenter 6.2 include:
Users can submit pairs of models for validation by CADIQ®. This can be used to validate models which have been remastered or otherwise modified.
A third party can be configured to approve transfers to other users. Users can review and approve translated results before forwarding to partners.
Model Preparation Module
A new model preparation module allows modification of native or neutral CAD models. This can automate manual processes required before delivering models to customers, partners or suppliers.
Inventor 2011 Support
Support for translation and validation of Inventor 2011 is now provided.
Microsoft SQLserver Database Support
SQLserver is now supported for the database component.
"DEXcenter has significantly improved the cost effectiveness and timeliness of collaboration efforts at customers around the world” said John Gray, DEXcenter Solution Manager. “These new capabilities add even greater value”. To see a video featuring the latest success story for DEXcenter, click here.
For more general information on DEXcenter, visit: www.dexcenter.com
About ITI and ITI TranscenData
International TechneGroup Incorporated (ITI) was founded in 1983 and is headquartered in Milford, OH. ITI TranscenData is the product data interoperability business within ITI. CAD/CAM/CAE/PLM vendors and end users alike utilize ITI TranscenData's products and services for seamless data exchange between dissimilar systems. Customers include ABB, Airbus, BAE Systems, Boeing, Dassault, EADS, Ford, Honeywell, Lego, Lockheed Martin, NASA, MAHLE Powertrain, Pratt & Whitney, Raytheon, Renault, Rockwell Collins, Samsung Electronics, Siemens, Snecma, Spirit AeroSystems, Thales, ThyssenKrupp, US Air Force, US Army, Xerox and others.