The Design Concept behind Vincotech Power Modules

February 17th 2012 - Vincotech produces highly efficient power modules with various housings designed for a wide range of power and other applications. The offering extends beyond standard motor drive topologies such as CIB / PIM, PACK, and half-bridge modules to encompass products designed specifically for PFC, welding, solar, and UPS applications. This paper describes the underlying design concepts for Vincotech’s flow 0, flow 1 and flow 2 families, as well as flowSCREW 2s and the new flowSCREW w housings. It also discusses the pros and cons of Press-fit pins, DBC substrates, and stress-relief zones. The different types of power module assemblies and topologies are described using a module with three levels as an example.

Designers in search of utmost efficiency and reliability for their applications will find the features and benefits they seek in Vincotech modules. Designed for a power range from 500 to 1700 V and from 4 to 600 A, these power modules feature a variety of topologies and technologies to satisfy the needs of the most diverse applications.

For more information please see the article describing the design concept behind Vincotech’s power modules:

About Vincotech:
Vincotech, an independent operating unit within Mitsubishi Electric Corporation, is a market leader in power modules in development and manufacturing of high-quality electronic power components for Motion Control, and Renewable Energy applications.
With some 500 employees worldwide, backed by vast experience and a long history in electronics integration, Vincotech leverages these assets to help customers attain maximum market success.
For more information please see:

Patrick Baginski,
Field Application Engineer,
Vincotech GmbH,
Email: Email Contact
Tel: +49 (0)2522 9370558

Distributed on behalf of Vincotech GmbH by NeonDrum news distribution service (

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