Mentor Graphics Announces 23rd Annual PCB Technology Leadership Awards Program Winners

WILSONVILLE, Ore. — (BUSINESS WIRE) — November 21, 2011 — Continuing in its tradition of promoting and recognizing printed circuit board (PCB) design excellence, Mentor Graphics Corporation (NASDAQ: MENT) today announced winners of its 23rd annual PCB Technology Leadership Awards. Started in 1988, this program is the longest running competition of its kind in the electronic design automation (EDA) industry. It recognizes engineers and computer aided design (CAD) designers who use innovative methods and design tools to address today’s complex PCB systems’ design challenges and produce industry-leading products.

"Mentor Graphics’ Technology Leadership Awards showcases the best electronics design teams in the industry,” said Pete Waddell, president of UP Media and publisher of Printed Circuit Design & Fab/Circuits Assembly Magazine. “The complexity of the designs and the commitment of the teams who worked on the designs, is a testament to the talents and innovative abilities of engineers and designers involved. They certainly earned the respect of those of us who are fortunate to be involved with the program.”

Industry experts judged entries from around the world in five categories representing a wide variety of industries. The PCB industry expert judges included Happy Holden, retired and former CTO, Foxconn Advanced Technology; Gary Ferrari, technical support director, FTG Circuits; Pete Waddell, president of UP Media, publisher of Printed Circuit Design & Fab/Circuits Assembly Magazine; Andy Kowalewski, senior interconnect designer, AdvantagePCB; and Rick Hartley, senior principal engineer, Avionics Division of L-3 Communications.

2011 Technology Leadership Award Winners

Category: Best Overall Design

Company: Wipro Technologies, India

Design team: Rakesh Raju Nadimetla, Radesh Gupta

Using: Board Station® RE, XtremePCB™, HyperLynx® SI/PI

Category: Computers, Blade & Servers, Memory Systems

1st place: GE Intelligent Platforms, UK

Design team: Mike Tapp, Rob Savage, Bryan Ledger, Stuart Connolly

Using: Expedition® PCB, HyperLynx SI/PI

2nd place: PFU, Japan

Design team: Junichi Nakagawa, Yuusuke Amakata, Seiji Yoshinaga, Yasuhide Chigawa

Using: Expedition PCB, CES, XtremePCB, HyperLynx SI/PI

Category: Consumer Electronics & Handhelds

1st place: LG Electronics, South Korea

Design team: Junhyeok Lee, Inmu Kim, Kun Joo

Using: Expedition Enterprise

2nd place: Avolites, UK

Designer: Alwyn Fernandes

Using: PADS®

Category: Industrial Control, Instrumentation, Security & Medical

1st place: Verigy, Germany

Designer: Oliver Knitterscheidt

Using: Board Station, HyperLynx PI

2nd place: Agilent, China

Designer: Bo Yao

Using: Expedition PCB

Category: Military & Aerospace

1st place: GE Intelligent Platforms, UK

Design team: Jim Rose, Michael Brewin, David Hart

Using: Expedition PCB, HyperLynx SI/PI

2nd place: SELEX Galileo S.p.A., Italy

Design team: Maurizio Pagani, Matteo Seminari, Aldo Boschiroli, Gregorio Vitale

Using: Expedition Enterprise, HyperLynx

Category: Telecom, Network Controllers, Line Cards

1st place: Alcatel-Lucent, USA

Design team: Mei Wong, Carboy Zhang Li Bo, Mark Darby, Aydin Cokoyoglu

Using: Board Station RE

2nd place: F5 Networks, USA

Design team: Debra Bandimere, Jarom Daines, Eric Daines, Jerry Canterbury

Using: CES, Expedition PCB

Category: Transportation & Automotive

1st place: Johnson Controls, USA

Design team: Scott Smith, Siddesh Vishwanath, Krzysztof Russa

Using: Expedition PCB, CES

2nd place: Huizhou Desay, China

Designer: Tan Baichuan

Using: Expedition PCB

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