Cadence Wins TSMC EDA Partner Award for 3D-IC Technology

SAN JOSE, CA -- (MARKET WIRE) -- Nov 14, 2011 -- Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced that TSMC has recognized Cadence with a TSMC EDA Partner Award for its 3D-IC technology. The award underscores the R&D investment from Cadence for this emerging technology, which will drive advances in IC and packaging to enhance performance and reduce power consumption, size and weight as the electronics industry moves into a new era of ultra portable devices.

Cadence was cited for helping implement an interposer test vehicle using Cadence standard 3D-IC solutions that employed through-silicon vias (TSV). The project involved a system-on-chip (SoC) and eDRAM integrated on a silicon interposer.

"Our in-depth collaborations with TSMC across many advanced projects in the IC domains had enabled TSMC and Cadence to take the leadership in 3D-IC," said Dr. Chi-Ping Hsu, senior vice president, research and development, Silicon Realization Group at Cadence. "With the complexity levels faced by today's chip design to deliver features along with performance, power and form factor goals, new approaches are needed to stay competitive, and 3D-IC is an important industry direction for addressing those challenges. We appreciate the recognition from TSMC and look forward to enabling the semiconductor industry with this important new technology."

"We are pleased to recognize the contributions Cadence has made in the field of 3D-IC," said Suk Lee, TSMC Director of Design Infrastructure Marketing. "The deployment of these new technologies will continue to drive the expansion of computing power and performance."

About Cadence

Cadence enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software, hardware, IP, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available at www.cadence.com.

Cadence and the Cadence logo are registered trademarks of Cadence Design Systems, Inc. in the United States and other countries. All other trademarks are the property of their respective owners.

Add to Digg Bookmark with del.icio.us Add to Newsvine

For more information, please contact:
Dean Solov
Cadence Design Systems, Inc.
408-944-7226

Email Contact 





Review Article Be the first to review this article
IMTS 2018 Register Now>>

Featured Video
Jobs
GIS Support Specialist for Palm Beach County at West Palm Beach, Florida
Upcoming Events
SEMICON Taiwan 2018 at Taipei Nangang Exhibition Center 1F&4F Taipei Taiwan - Sep 5 - 7, 2018
IMTS2018 International Manufacturing Tech Show at McCormick Place Chicago IL - Sep 10 - 15, 2018
Additive Manufacturing Conference 2018 at McCormick Place Convention Center's West Building in Room W375 Chicago IL - Sep 11 - 12, 2018
International Forum on Design for Manufacture and Assembly 2018 at Omni Providence Hotel Providence RI - Sep 11 - 12, 2018
Kenesto: 30 day trial
SolidCAM: See It Live



Internet Business Systems © 2018 Internet Business Systems, Inc.
25 North 14th Steet, Suite 710, San Jose, CA 95112
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation GISCafe - Geographical Information Services TechJobsCafe - Technical Jobs and Resumes ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise