Neilsoft Will be a sponsor at NASSCOM Engineering Summit 2011

October 3, 2011 - Neilsoft will be a sponsor at the 3rd edition of the Nasscom Engineering Summit 2011 scheduled at Pune, India on 12-13 October.

The summit will provide a unique platform to understand debate & strategize globalization of engineering, emerging markets and frugal engineering and new models of co-creation. Engineering, R&D, Design, and Innovation - all intertwined and critical aspects of building future products and services will come together at this Summit. The theme of this two day summit is 'Innovation and High Value Engineering', wherein thought leaders and renowned speakers from the Engineering Industry will share their insights, present case studies and conduct master classes.

This is a must attend for engineering companies, Global In-house Centers (GIC), engineering services providers, SMEs, academicians, analysts. So be there for two days of action where the globallyrenowned speakers will address 600+ participants and rub shoulders with thought leaders from Industry verticals including defense, avionics, automotive R&D, telecom, consumer electronics, medical electronics and heavy engineering.

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