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Posts Tagged ‘STEP’

Stratasys Unveils Spin-off Focusing on New AM Technology

Thursday, April 12th, 2018

This week, Stratasys officially unveiled the spin-off of its Selective Thermoplastic Electrophotographic Process (STEP) technology and forming of a new company, Evolve Additive Solutions.

After nearly 10 years as an incubation project, the new organization will be led by a dedicated management team, exclusively focused on bringing the proprietary STEP technology to market – aimed at delivering high-volume production additive manufacturing at breakthrough speeds compared to other commercially available additive processes.

Traditional manufacturers have long sought to combine the benefits of additive manufacturing with the material, quality and economics of traditional production processes. Built on Stratasys’ pioneering development and 3D printing and additive manufacturing expertise, Evolve’s STEP technology is aimed at producing parts at a cost, quality and throughput comparable to traditional manufacturing processes. The solution is intended for high-volume production runs into the hundreds of thousands per year. As such, it is expected to compete with traditional processes, such as injection molding.

For an overview of the STEP technology, click here.

“As an independent company, Evolve will best be able to focus on the advancement of the technology, provide the entrepreneurial environment and management equity incentives suitable for early stage efforts and drive the customer relationships and partnerships to foster further development and initial market adoption,” said Stratasys CEO, Ilan Levin. “As an equity stakeholder, we look forward to collaborating with Evolve and supporting this initiative to help make it a success.”

(more…)

Collaboration & Interoperability Congress 2012: Where’s JT?

Monday, May 21st, 2012

This week we are attending the Collaboration & Interoperability Congress (CIC) 2012. CIC is a unique independent vendor/technology/product-neutral event that addresses collaboration and interoperability in manufacturing and business processes. The event seems particularly well attended this year and represents by a wide range of industries and standards bodies.

One notable absence, however, was any representation from the JT camp — Siemens PLM Software. I would have thought that JT would take advantage of an event such as CIC to showcase and grandstand the data format. With no real presence, what are we to think? Is JT really as ubiquitous and pervasive as we have been led to believe? Maybe yes, maybe no. Admittedly, JT has its own conference this coming fall, but when just about every other interoperability technology provider shows up, why not JT? On the other hand, an organization that had a major presence was the relatively new 3DPDF Consortium.

CIC is an interesting conference because collaboration and interoperability are undergoing huge changes, due in large part to clould-based computing, storage, and software as service. Will the cloud be used exclusively tomorrow? Probably not, but over time it will be increasingly used as a primary digital data creation and management platform. In any case, interoperability in the cloud will become a bigger and bigger issue with great challenges, but also great opportunities.

An interesting session on the first day of the Congress discussed the following lightweight 3D formats:

  • STEP
  • 3DXML
  • 3D PDF
  • JT

Free viewers are largely what differentiate the above formats, but it was made clear that there is no such thing as a free viewer due to implementation and IP protection/security costs.

The 3D PDF format really got a lot of attention, at least during the first day of the Congress. It seems the reasons for this are the industrial strength tools available for 3D PDF, excellent user acceptance, and the fact that PDF is a widely recognized ISO standard (ISO 32000).

In the coming weeks, we’ll detail the advantages and disadvantages of each of the lightweight formats because they definitely have each.

As its central theme, CIC drives home the point that like living creatures and technologies, when it comes to evolution, it’s not necessarily the strongest or brightest that survive, it’s those who are the most adaptable. I think this will prove true and apply to collaboration and interoperability going forward.

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