With registration now open, the March 10th Tech Design Forum "EDA Edition" will focus on IC Design and Verification, exploring ecosystem networking and increasing competiveness in IC and system product development. Technical sessions, broken into four tracks, will specifically address the needs of the IC designer. These include Design-Manufacturing Co-Optimization, Large-Scale SoC Design and Test, Custom/AMS Design and Industry Initiatives, and System-Level Design and Verification. Panel discussions within those tracks will be moderated by journalists Ron Wilson (EDN magazine), Paul Dempsey (Tech Design Forum journal), and Daniel Nenni, (SemiWiki.com) and will include industry experts from ARM, Atrenta, Broadcom, Cadence, Cambridge Silicon Radio, eSilicon, GLOBALFOUNDRIES, Mentor Graphics, Samsung, SpringSoft, Synopsys, TSMC, and Xilinx. The free event will continue to offer the popular multi-vendor exhibitor fair.
The day begins at 9:00 AM with a keynote by Dr. Mario Paniccia, Intel Fellow, Director Photonics Technology Lab. His presentation, titled "Silicon Photonics - Enabling Optical for Every Computing Device," will discuss some of the recent advances in silicon photonics, including the first silicon photonics optical link operating at 50 Gbps, the scalability of this technology, and its potential applications. Kevin Keller, Principal Analyst, Teardown Services at iSuppli, rounds out the day at 3:15 PM with his teardown session, "Technology Convergence in Tablet Computing Devices: A Hardware Design Perspective."
The Tech Design Forum, under its former name, has been a key technical and networking resource for the electronics engineering community for the past eight years, which last year brought together over 5,000 attendees from over 2,000 companies. Its new name reflects the broader challenges facing today's engineers, such as the growing importance of software to a product's overall success, and the shift in day-to-day management processes as electronic product companies, manufacturers, and software vendors collaborate more closely.
The worldwide schedule of Tech Design Forum events for 2011 includes:
- March 10 - Santa Clara, CA
- April 11 - Tel Aviv, Israel
- July 20 - New Delhi, India
- July 22 - Bangalore, India
- August 25 - Tokyo, Japan
- August 31 - Shanghai, China
- September 6 - Beijing, China
- September 8 - Hsin-Chu, Taiwan
- September 8 - Santa Clara, CA
An important component of the Tech Design Forum series is the Tech Design Forum journal (formerly EDA Tech Forum), a quarterly technical publication available in print and online. The magazine is broadening its scope by emphasizing specific technology areas in each issue, as well as adding additional coverage online. Editor-in-chief, Paul Dempsey, will continue to provide editorial insight and leadership for the magazine, which will continue to address trends, pressing issues, challenges, methodologies, and problem-solving techniques for the overall electronic products industry.
Platinum sponsors of the 2011 Tech Design Forum include Altera, ARM, GLOBALFOUNDRIES, Mentor Graphics, Samsung, SpringSoft and TSMC. To register for upcoming Tech Design Forums, or to obtain more information about the Tech Design Forum journal, please visit our website or call 800-547-8016.
(All company or product names are the registered trademarks or trademarks of their respective owners.)
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For more information, please contact: Sonia Harrison Tech Design Forum 503.685.1165 Email Contact