Global Electronic Thermal Management Industry
http://www.reportlinker.com/p080463/Global-Electronic-Thermal-Management-Industry.html
This report analyzes the worldwide markets for Electronic Thermal Management in US$ Million by the following end-use segments: Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive. Also, the report provides market analytics for the Global and US market for the product segments - Hardware, Software, and Interfaces & Substrates. Annual estimates and forecasts are provided for the period 2007 through 2015. A six-year historic analysis is also provided for these markets. The report profiles 158 companies including many key and niche players such as II-VI, Incorporated, Marlow Industries, Aavid Thermalloy, LLC, Advanced Thermal Solutions, Inc., Alcoa, Inc., Alpha Metals, Alpha Technologies Group, Inc., Ametek, Inc., Amkor Technology, Inc., Ansys, Inc., Ansoft Corporation, Fluent, Inc., ASAT Holdings Ltd., Brush Engineered Materials, Inc., Ceramics Process Systems Corporation, Chomerics, Comair Rotron, Inc., Cookson Electronics Assembly Materials, Cool Innovations, Inc., Cooler Master Co., Ltd., C-Therm Technologies Ltd., CTS Corporation, Daat Research Corp., Degree Controls, Inc., Dow Corning Corporation, Dynatron Corporation, Enertron, Inc., Ferraz Shawmut, LLC, Fujikura Ltd., Henkel Loctite Corporation, Honeywell Electronic Materials, Intricast Company Inc., ITW Vortec, JARO Components, Inc., Kooltronic, Inc., Kyocera Corporation, Laird Technologies, Liebert Corporation, Lord Corporation, Lytron Incorporated, Mentor Graphics Corporation, Metal Matrix Cast Composites, LLC, Micronel U.S., Netzsch Instruments, Inc.., Netzsch Thermal Analysis, NMB Technologies Corporation, Noren Products, Inc.., Orient Semiconductor Electronics Ltd., PC Power & Cooling, Inc.., Pfannenberg, Inc., PLANSEE Thermal Management Solutions, Sumitomo Electric Industries, Ltd., Tech Spray, L. P., Tellurex Corp., Tennmax United, The Bergquist Company, The Filter Factory, Inc., Thermacore, Transene Company, Inc., U.S. Toyo Fan Corporation, United Thermal Engineering Corporation, Vette Corp., and Wakefield Thermal Solutions, Inc. Market data and analytics are derived from primary and secondary research. Company profiles are mostly extracted from URL research and reported select online sources.
ELECTRONIC THERMAL MANAGEMENT MCP-1523
A GLOBAL STRATEGIC BUSINESS REPORT
CONTENTS
1. INTRODUCTION, METHODOLOGY & PRODUCT DEFINITIONS 1
Study Reliability and Reporting Limitations 1
Disclaimers 2
Data Interpretation & Reporting Level 3
Quantitative Techniques & Analytics 3
Product Definitions and Scope of Study 3
End-Use Segments 4
1. Computers 4
2. Telecom 4
3. Medical/Office Equipment 4
4. Industrial/Military 4
5. Consumer Electronics 5
6. Automotive 5
Product Segments 5
1. Hardware 5
2. Software 5
3. Interfaces and Substrates 5
2. INDUSTRY OVERVIEW 6
Sophisticated Technology Needs Effective Thermal Management 6
Current and Future Analysis 6
Regional Perspective 6
End-Use Perspective 6
Product Segment Perspective 7
3. MARKET TRENDS 8
Recession Impacts the Market 8
Rising Complexities Present Lucrative Opportunities for
Electronic Thermal Management 8
PC Market Stimulates Growth 8
Thermal Management Subsystems Set for Robust Growth 8
New Technologies Under Development 9
Liquid Cooling Gaining Foothold 9
Semiconductor Manufacturers Look for Thermal Management
Technology 9
Heat Pipe Gains Popularity among PC Manufacturers 10
Imminent Growth for ICs 10
4. PRODUCT OVERVIEW 11
Thermal Management - A Critical Function 11
Electronic Thermal Management Products 11
Hardware 11
Heat Sinks 11
Heat Pipes 11
Micro Channels 12
Spray Cooling 12
Electronic Cooling Fans 12
Metal Backplanes 12
BGAs 13
Software 13
Computational Methods of Heat Transfer (CHT) and Fluid
Dynamics (CFD) 13
Electronic Design Automation (EDA) Software, Electronic
Computer Aided Design (ECAD) Software, and Technology
Computer Aided Design (TCAD) Software 13
Interfaces and Substrates 14
Thermal Compounds and Thermal Interface Materials 14
Thermal Management Applications 15
Computers 15
Notebooks/Laptops 15
Servers 16
Embedded PCs 16
Telecom 16
Medical 16
Industrial Electronics 17
Aerospace/Military 17
Consumer Electronics 17
Automotive 17
5. COMPETITIVE ENVIRONMENT IN RECENT PAST 18
Thermal Management - A Fragmented Market 18
Table 1: Leading Vendors in the Worldwide Thermal Management
Market (2006 & 2007) - Percentage Breakdown by Value Sales
for Amkor, Aavid Thermalloy, Fluent, Chomerics, Kyocera, and
Others (includes corresponding Graph/Chart) 18
Thermal Management Hardware Market 19
Table 2: Leading Players in the Worldwide Thermal Management
Hardware Market (2006 & 2007) - Percentage Breakdown by Value
Sales for Aavid Thermalloy, Thermacore, Lytron, and Others
(includes corresponding Graph/Chart) 19
Fluent - The Undisputed Thermal Management S/W Market Leader 20
Table 3: Leading Players in the Worldwide Thermal Management
Software Market (2006 & 2007) - Percentage Breakdown by Value
Sales for Fluent, Ansys, Flomerics, Daat, and Others
(includes corresponding Graph/Chart) 20
Chomerics and Bergquist Lead Thermal Management Interface Market 21
Table 4: Leading Players in the Worldwide Thermal Management
Interface Market (2006 & 2007) - Percentage Breakdown by
Value Sales for Chomerics, Bergquist, Aavid Thermalloy,
Lytron, and Others (includes corresponding Graph/Chart) 21
Amkor Dominates Thermal Management Substrate Market 22
Table 5: Leading Players in the Worldwide Thermal Management
Substrate Market (2006 & 2007) - Percentage Breakdown by
Value Sales for Amkor, Kyocera, ST ChipPAC, OSE, ASAT, and
Others (includes corresponding Graph/Chart) 22
6. PRODUCT INTRODUCTIONS/INNOVATIONS 23
LORD Unveils MT-815 Low Modulus Increased Thermal Conductivity
Adhesive 23
Thermaltake Introduces Thermaltake SlimX3 23
Honeywell Electronic Materials Launches Honeywell PCM45M-SP 23
AdaptivCool Develops HotSpotr HT-510 24
Nuventix Introduces SynJet Spot Light Cooler 25
DSM Engineering Plastics Unveils Thermally Conductive PA46
Material 25
Micropelt Launches MPC-D40x Thermoelectric Coolers 25
Pfannenberg Unveils New DTS 3000 Side-Mount Cooling Units 26
California Micro Devices Launches LuxGuard™ CM1771 26
Honeywell Unveils Pb-free Die Attach Solder 26
Nuventix Introduces New Line of SynJet Coolers 27
Indium Launches Heat-Spring® Thermal Interface Material 27
Parker Hannifin Launches Two-Phase Liquid Cooling System 28
Nuventix and National Semiconductor Launch Electronic Drive
and Reference Design 28
Honeywell International Unveils Honeywell PTM 3180 29
RS Components Unveils New Thermal Management Solutions 29
Arun Components Launches Alutronic Line of Heatsink Systems 30
Nextreme Thermal Solutions Introduces New Series of OptoCooler
High Voltage Modules 30
Vette Introduces Aluma-Cop Liquid Cooling 31
SprayCool Launches Multi-Platform Enclosure 31
Celsia Technologies Unveils Advanced NanoSpreader 31
STABLCOR Introduces ST10-LC909 Products 32
7. PRODUCT INNOVATIONS/LAUNCHES IN RECENT PAST - A PERSPECTIVE
BUILDER 33
SMART Releases Liquid-Cooled VLP DDR2 Registered DIMMs 33
LORD Develops Materials for Thermal Management 33
Dow Corning Introduces New Thermally Conductive Compound 33
Astrosyn Unveils a Range of Slide-fit Heatsink Enclosures 34
Dell Develops a Liquid-Cooled Heat Sink 34
Fujipoly America Develops an Innovative Thermal Interface
Material 34
Flomerics to Offer T3Ster Thermal Testing System 34
Andigilog® Develops ThermalEdge™ Cooling Technology 34
Andigilog® Introduces Thermal Management Solutions 35
Celsia Releases MicroSpreader™ 35
Sunon Develops Liquid Circulation Cooling System 35
EBM-PAPST Develops Advanced Liquid Cooling System 36
EBM-PAPST Introduces New Fan-Cooling Technology 36
Hybricon Introduces Liquid-Cooled ATR Chassis 36
Ansoft Launches Latest Version of ePhysics as ePhysics v2 37
CTS Launches New Line of Low-Profile Forged Heat Sinks 37
Honeywell Introduces Screen Printable Phase Change Material in
Chip Manufacture 37
Laird Launches Thermally Conductive, Electrically Insulating
T-preg™ HTD for PCBs 38
Laird Introduces Deep Drawing Capability for Shielding
Applications 38
Laird Introduces Low-Cost T-Gard™ for SMPS Devices 38
Laird Introduces T-Gard™ 500 High Performance Insulator for
Automotive Industry 39
Jaro Develops 450 CFM AC Cooling Fan for Industrial Use 39
Jaro Develops IC Cooling Fan With High Flow and Cooling Value 39
Mathis Develops Mathis TCi™ For Improved Thermal Conductivity
Testing 39
Melcor Introduces Extrusion Heat Sinks With Improved Performance 39
Fluent Launches New Environmental Thermal Audit Solution for
Data Centers 40
Kooltronic Introduces Advanced Enclosure Accessories 40
Pfannerberg Develops Filterfan® 40
8. RECENT INDUSTRY ACTIVITY 41
Thermacore Snaps Up Pittsburgh Materials Technology 41
Parker Hannifin Takes Over SprayCool 41
Dow Kokam Acquires Societe de Vehicles Electriques 41
BorgWarner Establishes Manufacturing Plant 42
MAHLE Acquires Majority Stake in BEHR Industry 42
CoolIT Systems Takes Over Assets of Delphi Thermal Liquid Cooling 42
Curtiss-Wright Snaps Up EST Group 43
Arlington Capital Partners Acquires J.A. Reinhardt 43
Thermacore Takes Over k Technology 43
IBM Collaborates with Vette 44
Bias Power Collaborates with Nuventix 44
Roal Electronics Collaborates with Nuventix 45
Electronic Environments Inks Partnership Agreement with
AdaptivCool 45
Asetek Forms Alliance with Corsair 45
AdaptivCool and Yamatake Sign Agreement 46
Toyal America forms Alliance with E.W. Kaufmann 46
Stablcor and Elvia PCB Group Ink Licensing Agreement 46
Weidmann Electrical Technology and LumaSense Technologies Ink
Strategic Partnership Agreement 46
Thermacore Bags Contract from Defense Advanced Research
Projects Agency 47
Waytronx Takes Over CUI 47
Photochemie Signs Licensing Agreement with Stablcor 47
ON Semiconductor Establishes Research and Development Centre 48
Stablcor and Graphic Ink Licensing Agreement 48
Texas Instruments Takes Over Commergy Technologies 48
Thermal Energy International Takes Over Gardner Energy Management 48
nCoat Inks Agreement with BSR Solar Technologies and
Sunvention USA 48
CSP Inc. MultiComputer Division Signs Agreement with
SprayCool® Technologies 49
Mentor Graphics Takes Over Flomerics Group 49
Modine Divests Thermacore 49
9. CORPORATE ACTIVITY IN RECENT PAST - A PERSPECTIVE BUILDER 50
Moog Takes Over Thermal Control Products 50
Rensselaer Teams Up with Varsities to Develop Cooling Techniques 50
Laird Partners with Sager Electronics 51
Honeywell to Expand R&D Facility 51
Vette Adds ERM 51
Laird Takes Over Supercool 52
Arlington Capital Acquires Woven Electronics Through Thermal
Solutions 52
Parker Hannifin Purchases Acofab and Adecem 52
Ametek Adds Land Instruments 52
Lytron Adds Lockhart Industries 53
Seki Technotron Purchases 10% Interest in sp3 Inc. 53
OnScreen Purchases Patent of WayCool Thermal Cooling Technology 53
Flomerics Acquires NIKA 54
Aavid Merges with Ansys and Spins-Off Thermal Management Business 54
Celsia and Yeh-Chiang Sign Agreement 54
Nextreme Inks License Deal with Caltech 54
Celsia Signs Sales & Development Pact with Lighting Science 55
Celsia Contracts with Kubo to Expand in Japan 55
Hybricon and Parker Hannifin Sign Pact for Cooling Solutions 55
Rogers and Thermal Transfer Composites Partner 56
sp3 Partners with CPS 56
Celsia Teams Up with AET 56
Mathis Forms Distribution Partnership with Setaram
Instrumentation 57
10. FOCUS ON SELECT PLAYERS 58
VI, Incorporated (US) 58
Marlow Industries (US) 58
Aavid Thermalloy, LLC (US) 58
Advanced Thermal Solutions, Inc. (US) 58
Alcoa, Inc. (US) 59
Alpha Technologies, Inc. (US) 59
Ametek, Inc. (US) 59
Amkor Technology, Inc. (US) 60
Ansys, Inc. (US) 60
Ansoft Corporation (US) 61
Fluent, Inc. (US) 61
ASAT Holdings Ltd. (Hong Kong) 61
Brush Engineered Materials, Inc. (US) 62
Ceramics Process Systems Corporation (US) 62
Chomerics (US) 62
Comair Rotron, Inc. (US) 63
Cookson Electronics Assembly Materials (US) 63
Cool Innovations, Inc. (US) 63
Cooler Master Co., Ltd. (UK) 64
C-Therm Technologies Ltd. (Canada) 64
CTS Corporation (US) 64
Daat Research Corp. (US) 65
Degree Controls, Inc. (US) 65
Dow Corning Corporation (US) 65
Dynatron Corporation (US) 65
Enertron, Inc. (US) 66
Ferraz Shawmut, LLC (Canada) 66
Fujikura Ltd. (Japan) 66
Henkel Loctite Corporation (US) 66
Honeywell Electronic Materials (US) 67
Intricast Company Inc (US) 67
ITW Vortec (US) 67
JARO Components, Inc. (US) 68
Kooltronic, Inc. (US) 68
Kyocera Corporation (Japan) 68
Laird Technologies (US) 68
Liebert Corporation (US) 69
Lord Corporation (US) 69
Lytron Incorporated (US) 69
Mentor Graphics Corporation (US) 69
Metal Matrix Cast Composites, LLC (US) 70
Micronel U.S. (US) 70
Netzsch Instruments, Inc. (US) 70
Netzsch Thermal Analysis (Germany) 70
NMB Technologies Corporation (US) 71
Noren Products, Inc. (US) 71
Orient Semiconductor Electronics Ltd. (Taiwan) 71
PC Power & Cooling, Inc. (US) 71
Pfannenberg, Inc. (US) 72
PLANSEE Thermal Management Solutions (US) 72
Sumitomo Electric Industries, Ltd. (Japan) 72
Tech Spray, L. P. (UK) 72
Tellurex Corp. (US) 73
Tennmax United (US) 73
The Bergquist Company (US) 73
The Filter Factory, Inc. (US) 74
Thermacore (US) 74
Transene Company, Inc. (US) 74
U.S. Toyo Fan Corporation (US) 75
United Thermal Engineering Corporation (US) 75
Vette Corp. (US) 75
Wakefield Thermal Solutions, Inc. (US) 76
11. GLOBAL MARKET PERSPECTIVE 77
Table 6: World Recent Past, Current & Future Analysis for
Electronic Thermal Management by Geographic Region - US,
Canada, Japan, Europe, Asia-Pacific (excluding Japan) and Rest
of World Independently Analyzed with Annual Sales Figures in
US$ Million for Years 2007 through 2015 (includes
corresponding Graph/Chart) 77
Table 7: World Historic Review for Electronic Thermal
Management by Geographic Region - US, Canada, Japan, Europe,
Asia-Pacific (excluding Japan), and Rest of World Markets
Independently Analyzed with Annual Sales Figures in US$
Million for Years 2001 through 2006 (includes corresponding
Graph/Chart) 78
Table 8: World 11-Year Perspective for Electronic Thermal
Management by Geographic Region - Percentage Breakdown of
Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific
(excluding Japan) and Rest of World Markets for Years 2005,
2010 & 2015 (includes corresponding Graph/Chart) 79
Table 9: World Recent Past, Current & Future Analysis for
Electronic Thermal Management by Product Segment- Hardware,
Software, and Interfaces & Substrates Independently Analyzed
with Annual Sales Figures in US$ Million for Years 2007
through 2015 (includes corresponding Graph/Chart) 80
Table 10: World Historic Review for Electronic Thermal
Management by Product Segment - Hardware, Software, and
Interfaces & Substrates Markets Independently Analyzed with
Annual Sales Figures in US$ Million for Years 2001 through
2006 (includes corresponding Graph/Chart) 81
Table 11: World 11-Year Perspective for Electronic Thermal
Management by Product Segment - Percentage Breakdown of Dollar
Sales for Hardware, Software, and Interfaces & Substrates
Markets for Years 2005, 2010 & 2015 (includes corresponding
Graph/Chart) 81
Table 12: World Recent Past, Current & Future Analysis for
Electronic Thermal Management in Computers by Geographic
Region - US, Canada, Japan, Europe, Asia-Pacific (excluding
Japan) and Rest of World Independently Analyzed with Annual
Sales Figures in US$ Million for Years 2007 through 2015
(includes corresponding Graph/Chart) 82
Table 13: World Historic Review for Electronic Thermal
Management in Computers by Geographic Region - US, Canada,
Japan, Europe, Asia-Pacific (excluding Japan), and Rest of
World Markets Independently Analyzed with Annual Sales Figures
in US$ Million for Years 2001 through 2006 (includes
corresponding Graph/Chart) 83
Table 14: World 11-Year Perspective for Electronic Thermal
Management in Computers by Geographic Region - Percentage
Breakdown of Dollar Sales for US, Canada, Japan, Europe,
Asia-Pacific (excluding Japan) and Rest of World Markets for
Years 2005, 2010 & 2015 (includes corresponding Graph/Chart) 84
Table 15: World Recent Past, Current & Future Analysis for
Electronic Thermal Management in Telecom by Geographic Region
- US, Canada, Japan, Europe, Asia-Pacific (excluding Japan)
and Rest of World Independently Analyzed with Annual Sales
Figures in US$ Million for Years 2007 through 2015 (includes
corresponding Graph/Chart) 85
Table 16: World Historic Review for Electronic Thermal
Management in Telecom by Geographic Region - US, Canada,
Japan, Europe, Asia-Pacific (excluding Japan), and Rest of
World Markets Independently Analyzed with Annual Sales Figures
in US$ Million for Years 2001 through 2006 (includes
corresponding Graph/Chart) 86
Table 17: World 11-Year Perspective for Electronic Thermal
Management in Telecom by Geographic Region - Percentage
Breakdown of Dollar Sales for US, Canada, Japan, Europe,
Asia-Pacific (excluding Japan) and Rest of World Markets for
Years 2005, 2010 & 2015 (includes corresponding Graph/Chart) 87
Table 18: World Recent Past, Current & Future Analysis for
Electronic Thermal Management in Medical/ Office Equipment by
Geographic Region - US, Canada, Japan, Europe, Asia-Pacific
(excluding Japan) and Rest of World Independently Analyzed
with Annual Sales Figures in US$ Million for Years 2007
through 2015 (includes corresponding Graph/Chart) 88
Table 19: World Historic Review for Electronic Thermal
Management in Medical/Office Equipment by Geographic Region -
US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and
Rest of World Markets Independently Analyzed with Annual Sales
Figures in US$ Million for Years 2001 through 2006 (includes
corresponding Graph/Chart) 89
Table 20: World 11-Year Perspective for Electronic Thermal
Management in Medical/Office Equipment by Geographic Region -
Percentage Breakdown of Dollar Sales for US, Canada, Japan,
Europe, Asia-Pacific (excluding Japan) and Rest of World
Markets for Years 2005, 2010 & 2015 (includes corresponding
Graph/Chart) 90
Table 21: World Recent Past, Current & Future Analysis for
Electronic Thermal Management in Industrial/Military by
Geographic Region - US, Canada, Japan, Europe, Asia-Pacific
(excluding Japan) and Rest of World Independently Analyzed
with Annual Sales Figures in US$ Million for Years 2007
through 2015 (includes corresponding Graph/Chart) 91
Table 22: World Historic Review for Electronic Thermal
Management in Industrial/Military by Geographic Region - US,
Canada, Japan, Europe, Asia-Pacific (excluding Japan), and
Rest of World Markets Independently Analyzed with Annual Sales
Figures in US$ Million for Years 2001 through 2006 (includes
corresponding Graph/Chart) 92
Table 23: World 11-Year Perspective for Electronic Thermal
Management in Industrial/Military by Geographic Region -
Percentage Breakdown of Dollar Sales for US, Canada, Japan,
Europe, Asia-Pacific (excluding Japan) and Rest of World
Markets for Years 2005, 2010 & 2015 (includes corresponding
Graph/Chart) 93
Table 24: World Recent Past, Current & Future Analysis for
Electronic Thermal Management in Consumer Electronics by
Geographic Region - US, Canada, Japan, Europe, Asia-Pacific
(excluding Japan) and Rest of World Independently Analyzed
with Annual Sales Figures in US$ Million for Years 2007
through 2015 (includes corresponding Graph/Chart) 94
Table 25: World Historic Review for Electronic Thermal
Management in Consumer Electronics by Geographic Region - US,
Canada, Japan, Europe, Asia-Pacific (excluding Japan), and
Rest of World Markets Independently Analyzed with Annual Sales
Figures in US$ Million for Years 2001 through 2006 (includes
corresponding Graph/Chart) 95
Table 26: World 11-Year Perspective for Electronic Thermal
Management in Consumer Electronics by Geographic Region -
Percentage Breakdown of Dollar Sales for US, Canada, Japan,
Europe, Asia-Pacific (excluding Japan) and Rest of World
Markets for Years 2005, 2010 & 2015 (includes corresponding
Graph/Chart) 96
Table 27: World Recent Past, Current & Future Analysis for
Electronic Thermal Management in Automotive by Geographic
Region - US, Canada, Japan, Europe, Asia-Pacific (excluding
Japan) and Rest of World Independently Analyzed with Annual
Sales Figures in US$ Million for Years 2007 through 2015
(includes corresponding Graph/Chart) 97
Table 28: World Historic Review for Electronic Thermal
Management in Automotive by Geographic Region - US, Canada,
Japan, Europe, Asia-Pacific (excluding Japan), and Rest of
World Markets Independently Analyzed with Annual Sales Figures
in US$ Million for Years 2001 through 2006 (includes
corresponding Graph/Chart) 98
Table 29: World 11-Year Perspective for Electronic Thermal
Management in Automotive by Geographic Region - Percentage
Breakdown of Dollar Sales for US, Canada, Japan, Europe,
Asia-Pacific (excluding Japan) and Rest of World Markets for
Years 2005, 2010 & 2015 (includes corresponding Graph/Chart) 99
12. UNITED STATES 100
A.Market Analysis 100
Current and Future Analysis 100
By End-Use Segment 100
By Product Segment 100
Rising Complexities Present Lucrative Opportunities for
Electronic Thermal Management 100
Price Pressures and Shifting of Manufacturing to Asia to
Restrain Growth 100
B.Market Analytics 101
Table 30: US Recent Past, Current & Future Analysis for
Electronic Thermal Management by Product Segment - Hardware,
Software, and Interfaces & Substrates Markets Independently
Analyzed with Annual Sales Figures in US$ Million for Years
2007 through 2015 (includes corresponding Graph/Chart) 101
Table 31: US Historic Review for Electronic Thermal
Management by Product Segment - Hardware, Software, and
Interfaces & Substrates Markets Independently Analyzed with
Annual Sales Figures in US$ Million for Years 2001 through
2006 (includes corresponding Graph/Chart) 102
Table 32: US 11-Year Perspective for Electronic Thermal
Management by Product Segment - Percentage Breakdown of
Dollar Sales for Hardware, Software, and Interfaces &
Substrates Markets for Years 2005, 2010 & 2015 (includes
corresponding Graph/Chart) 102
Table 33: US Recent Past, Current & Future Analysis for
Electronic Thermal Management by End-Use Segment -
Computers, Telecom, Medical/Office Equipment,
Industrial/Military, Consumer Electronics, and Automotive
Markets Independently Analyzed with Annual Sales Figures in
US$ Million for Years 2007 through 2015 (includes
corresponding Graph/Chart) 103
Table 34: US Historic Review for Electronic Thermal
Management by End-Use Segment - Computers, Telecom,
Medical/Office Equipment, Industrial/Military, Consumer
Electronics, and Automotive Markets Independently Analyzed
with Annual Sales Figures in US$ Million for Years 2001
through 2006 (includes corresponding Graph/Chart) 104
Table 35: US 11-Year Perspective for Electronic Thermal
Management by End-Use Segment - Percentage Breakdown of
Dollar Sales for Computers, Telecom, Medical/Office
Equipment, Industrial/Military, Consumer Electronics, and
Automotive Markets for 2005, 2010 & 2015 (includes
corresponding Graph/Chart) 105
13. CANADA 106
Market Analysis 106
Table 36: Canadian Recent Past, Current & Future Analysis
for Electronic Thermal Management by End-Use Segment -
Computers, Telecom, Medical/ Office Equipment,
Industrial/Military, Consumer Electronics, and Automotive
Markets Independently Analyzed with Annual Sales Figures in
US$ Million for Years 2007 through 2015 (includes
corresponding Graph/Chart) 106
Table 37: Canadian Historic Review for Electronic Thermal
Management by End-Use Segment - Computers, Telecom,
Medical/Office Equipment, Industrial/Military, Consumer
Electronics, and Automotive Markets Independently Analyzed
with Annual Sales Figures in US$ Million for Years 2001
through 2006 (includes corresponding Graph/Chart) 107
Table 38: Canadian 11-Year Perspective for Electronic
Thermal Management by End-Use Segment - Percentage Breakdown
of Dollar Sales for Computers, Telecom, Medical/Office
Equipment, Industrial/Military, Consumer Electronics, and
Automotive Markets for 2005, 2010 & 2015 (includes
corresponding Graph/Chart) 108
14. JAPAN 109
Market Analysis 109
Table 39: Japanese Recent Past, Current & Future Analysis
for Electronic Thermal Management by End-Use Segment -
Computers, Telecom, Medical/ Office Equipment,
Industrial/Military, Consumer Electronics, and Automotive
Markets Independently Analyzed with Annual Sales Figures in
US$ Million for Years 2007 through 2015 (includes
corresponding Graph/Chart) 109
Table 40: Japanese Historic Review for Electronic Thermal
Management by End-Use Segment - Computers, Telecom,
Medical/Office Equipment, Industrial/Military, Consumer
Electronics, and Automotive Markets Independently Analyzed
with Annual Sales Figures in US$ Million for Years 2001
through 2006 (includes corresponding Graph/Chart) 110
Table 41: Japanese 11-Year Perspective for Electronic
Thermal Management by End-Use Segment - Percentage Breakdown
of Dollar Sales for Computers, Telecom, Medical/Office
Equipment, Industrial/Military, Consumer Electronics, and
Automotive Markets for 2005, 2010 & 2015 (includes
corresponding Graph/Chart) 111
15. EUROPE 112
Market Analysis 112
Table 42: European Recent Past, Current & Future Analysis
for Electronic Thermal Management by End-Use Segment -
Computers, Telecom, Medical/ Office Equipment,
Industrial/Military, Consumer Electronics, and Automotive
Markets Independently Analyzed with Annual Sales Figures in
US$ Million for Years 2007 through 2015 (includes
corresponding Graph/Chart) 112
Table 43: European Historic Review for Electronic Thermal
Management by End-Use Segment - Computers, Telecom,
Medical/Office Equipment, Industrial/Military, Consumer
Electronics, and Automotive Markets Independently Analyzed
with Annual Sales Figures in US$ Million for Years 2001
through 2006 (includes corresponding Graph/Chart) 113
Table 44: European 11-Year Perspective for Electronic
Thermal Management by End-Use Segment - Percentage Breakdown
of Dollar Sales for Computers, Telecom, Medical/Office
Equipment, Industrial/Military, Consumer Electronics, and
Automotive Markets for 2005, 2010 & 2015 (includes
corresponding Graph/Chart) 114
16. ASIA-PACIFIC 115
A.Market Analysis 115
Current and Future Analysis 115
Taiwan Market Scenario 115
B.Market Analytics 116
Table 45: Asia-Pacific Recent Past, Current & Future
Analysis for Electronic Thermal Management by End-Use
Segment - Computers, Telecom, Medical/Office Equipment,
Industrial/ Military, Consumer Electronics, and Automotive
Markets Independently Analyzed with Annual Sales Figures in
US$ Million for Years 2007 through 2015 (includes
corresponding Graph/Chart) 116
Table 46: Asia-Pacific Historic Review for Electronic
Thermal Management by End-Use Segment - Computers, Telecom,
Medical/Office Equipment, Industrial/Military, Consumer
Electronics, and Automotive Markets Independently Analyzed
with Annual Sales Figures in US$ Million for Years 2001
through 2006 (includes corresponding Graph/Chart) 117
Table 47: Asia-Pacific 11-Year Perspective for Electronic
Thermal Management by End-Use Segment - Percentage Breakdown
of Dollar Sales for Computers, Telecom, Medical/Office
Equipment, Industrial/Military, Consumer Electronics, and
Automotive Markets for 2005, 2010 & 2015 (includes
corresponding Graph/Chart) 118
17. REST OF WORLD 119
Market Analysis 119
Table 48: Rest of World Recent Past, Current & Future
Analysis for Electronic Thermal Management by End-Use
Segment - Computers, Telecom, Medical/Office Equipment,
Industrial/Military, Consumer Electronics, and Automotive
Markets Independently Analyzed with Annual Sales Figures in
US$ Million for Years 2007 through 2015 (includes
corresponding Graph/Chart) 119
Table 49: Rest of World Historic Review for Electronic
Thermal Management by End-Use Segment - Computers, Telecom,
Medical/Office Equipment, Industrial/Military, Consumer
Electronics, and Automotive Markets Independently Analyzed
with Annual Sales Figures in US$ Million for Years 2001
through 2006 (includes corresponding Graph/Chart) 120
Table 50: Rest of World 11-Year Perspective for Electronic
Thermal Management by End-Use Segment - Percentage Breakdown
of Dollar Sales for Computers, Telecom, Medical/Office
Equipment, Industrial/Military, Consumer Electronics, and
Automotive Markets for 2005, 2010 & 2015 (includes
corresponding Graph/Chart) 121
COMPETITION
Total Companies Profiled: 158 (including Divisions/Subsidiaries - 178)
------------------------------------------
Region/Country Players
------------------------------------------
The United States 120
Canada 4
Japan 6
Europe 35
France 3
Germany 4
The United Kingdom 17
Italy 5
Spain 1
Rest of Europe 5
Asia-Pacific (Excluding Japan) 13
------------------------------------------
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