3DVIA Debuts Support for COLLADA’s .dae Format at SIGGRAPH 2009
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3DVIA Debuts Support for COLLADA’s .dae Format at SIGGRAPH 2009

CONCORD, Mass. & PARIS, August 4, 2009 — Dassault Systèmes (DS) (Euronext Paris: #13065, DSY.PA), the world leader in 3D and Product Lifecycle Management (PLM) solutions, today announced that 3D models hosted on the 3DVIA.com library, including those created using the company’s free 3DVIA Shape modeling application, will now be automatically converted to both Dassault Systèmes’ 3DXML format and the COLLADA open 3D format (.dae format) created by the Khronos Group. The addition of COLLADA support further connects the 3DVIA product lineup to the wide range of digital content creation (DCC) software and applications that also support the .dae format.

3DVIA.com is an online community where over 110,000 registered 3D artists, application developers and enthusiasts from around the world interact with one another, learn from 3D experts and exchange their own 3D creations online through the 3DVIA interactive viewer. 3DVIA already supports the uploading and sharing of 3D models in many popular file formats, including: .3dxml, .3ds, .obj, .kmz, .iges and .step. To support the COLLADA announcement, the site has converted all existing 15,000 public models over to the .dae format and will automatically convert and store any new models published to the public warehouse in both formats.

"Khronos warmly welcomes Dassault Systèmes' adoption of COLLADA to foster the widely accessible exchange of 3D models on 3DVIA.com. Use of COLLADA will not only enable a vibrant modeling community across diverse markets, it will protect designers' investment in assets as their design evolves over the years," said Neil Trevett, president of the Khronos Group and vice president of NVIDIA.

“Our goal is to make it extremely easy for a broad community to leverage 3D as a communication medium—empowering all kinds of people to create and share professional quality, 3D experiences,” said Lynne Wilson, CEO of Dassault Systèmes’ 3DVIA brand. “Having both 3DXML and COLLADA uniquely positions 3DVIA.com to collect, showcase and share the wide array of 3D content created by the both the CAD and DCC communities.”

Attendees of this year’s SIGGRAPH event can visit the 3DVIA booth #3009 where 3DVIA will demonstrate its complete product line, including the new COLLADA support. 3DVIA will also publish a live video stream of its SIGGRAPH demonstrations through both www.3DVIA.com and www.3DVIA.tv.

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About 3DVIA
3DVIA, the newest brand in the Dassault Systemes portfolio, delivers lifelike 3D experiences to the world's rapidly expanding digital communities. It represents a bold commitment to extend 3D technology to new users, businesses, and consumers. By delivering products designed specifically for non-traditional users for 3D applications, 3DVIA establishes an entirely new way for companies to communicate across the enterprise and directly with consumers using 3D as a universal language. For more information about 3DVIA, go to: http://www.3dvia.com and http://www.3dvia.com/software

About Dassault Systèmes
As a world leader in 3D and Product Lifecycle Management (PLM) solutions, Dassault Systèmes brings value to more than 100,000 customers in 80 countries. A pioneer in the 3D software market since 1981, Dassault Systèmes develops and markets PLM application software and services that support industrial processes and provide a 3D vision of the entire lifecycle of products from conception to maintenance to recycling. The Dassault Systèmes portfolio consists of CATIA for designing the virtual product - SolidWorks for 3D mechanical design - DELMIA for virtual production - SIMULIA for virtual testing - ENOVIA for global collaborative lifecycle management, and 3DVIA for online 3D lifelike experiences. Dassault Systèmes’ shares are listed on Euronext Paris (#13065, DSY.PA) and Dassault Systèmes’ ADRs may be traded on the US Over-The-Counter (OTC) market (DASTY). For more information, visit http://www.3ds.com.

CATIA, DELMIA, ENOVIA, SIMULIA, SolidWorks and 3D VIA are registered trademarks of Dassault Systèmes or its subsidiaries in the US and/or other countries.


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